W Target Tungsten Sputtering Target for Semiconductor /Memory Chips

Product Details
Customization: Available
Type: Metal Target
Shape: Customized
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  • W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
  • W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
  • W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
  • W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
  • W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
  • W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
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  • Overview
  • Product Description
  • Detailed Photos
  • Our Advantages
  • Certifications
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
Pure Tungsten
Certification
ISO, CE
Purity
>5n 99.999%
Color
Silver
Size
Customized
Packing
Wooden Case
Transport
by Express, Air, Sea
Application
Semiconductor /Memory Chips
Transport Package
Wooden Case Outside
Specification
Customized
Trademark
TECHNO-TEC
Origin
China, Suzhou
HS Code
8101991000
Production Capacity
3000kg/Year

Product Description

Product Description
Name Cr Target
Material Chromium 
Purity 99.9~99.999%
Size Customized
Color Silver
Shape Customized
Surface Polished Surface;Ra≤0.8μm
Density ≥19.156g/cm³(99%)
Application Used for PVD Film Coating,Optical Thin Film Coating,Decoration film Coating,etc.
We support customization of all relevant data. For customization service, please contact us before placing order. (Price is based on size and purity)
 
Detailed Photos

 

 

Chromium Target
W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
W Target Tungsten Sputtering Target for Semiconductor /Memory Chips
W Target Tungsten Sputtering Target for Semiconductor /Memory Chips



 
Our Advantages

Professional team: Our bonding technologies have been inherited for more 50 years. Members of our engineering team are mainly from countries and regions including South Korea, Japan and all the bonding engineers have nearly 20 years of bonding experience.

Technical abilities: We are capable of bonding of 8.5G large-sized targets, 3.8M ultra-long type cylindrical targets, various ceramics and metal targets.

Facility advantages: Large FSLine UT measuring equipment;
Adjusting stand capable of adjusting 8.5G planar targets;
Large heating stand made in Japan;
Multifunctional cylindrical target bonding equipment;
State-of-the-art 8.5G bonding equipment.

Customers reputation: Over 80% of our customers are ranked in the Forbes Global 500 list and 70% of our products are exported.
W Target Tungsten Sputtering Target for Semiconductor /Memory Chips

Certifications

W Target Tungsten Sputtering Target for Semiconductor /Memory Chips

Packaging & Shipping

We take care in preparing your order and we will make sure every product is qualified before packaging. We conduct 100% detailed inspection for each product rather than random test. For boxes, we offer different sizes and shapes, configure protection measures such as anti-crash, anti-crack and anti-oxidation to accommodate different kinds of products. Our packaging meets standard shipping guidelines and environment-friendly principles. To determine customers' individualized needs, we have the ability to deliver customized packaging solutions.

The shipping fee will vary by type of product, weight and distance of travel. We try our best to arrange the recyclable packaging materials and affordable shipping methods to have the product arrive safely and in perfect condition. We have drop-shipping services and a network of international logistic partners. Our dedication is to delivering best-of-market products and services to our clients world-wide.
 

W Target Tungsten Sputtering Target for Semiconductor /Memory ChipsW Target Tungsten Sputtering Target for Semiconductor /Memory Chips
 
FAQ
Q:What is the situation with QC management?

A:We will strictly control the following steps:
Incoming inspection→Melting→Cutting→Cleaning and trimming→Forging and rolling→Heat treatment→Shape processing→Grinding→Step processing→Final inspection→Cleaning and packing→Warehousing




Q:How is the delivery time guaranteed?

A:When there are renew orders, we usually prepare stock in advance to ensure that the delivery time is on time.



 

Q:Have you received certifications from any well-known companies?

A:Our company has supply certifications from Panasonic, BOE Technology Group, and other large well-known enterprises.
W Target Tungsten Sputtering Target for Semiconductor /Memory Chips

 

 

 

 


 

 

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